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The silicon carbide particles (SiC p ) dispersion-strengthened copper matrix composites (Cu/SiC p ) were fabricated by composite electroforming technology. The microstructure, tensile property and wear behavior of Cu/SiC p composites were investigated. The results showed that composites with different SiC p contents were obtained. The microstructure of the composite...
The composite electroforming technology was propounded to fabricate silicon carbide powder (SiC p ) reinforced copper-based composites. The influences of the concentration of SiC p in plating solution, the temperature of plating solution and current density on the SiC p content in Cu/SiC p composites were studied. Results showed that it could promote codeposition of...
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