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Influence of Cr on growth of interfacial intermetallic compound (IMC) at the interface of Sn–9Zn/Cu substrate during aging at 85°C/20%RH and 85°C/85%RH for 500h has been investigated. After aging treatment, IMC layer at the Sn–9Zn/Cu joint is much thicker than that at the Sn–9Zn–Cr/Cu joint. Estimation according to experimental data presents that IMC growth rate of Sn–9Zn–Cr/Cu interface is about...
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