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In this paper, we first propose an efficient crosstalk-included eye-diagram estimation method for high-speed interposer channel on 2.5-D and three-dimensional (3-D) IC. The proposed method includes crosstalk effects from adjacent channels, which can considerably degrade the transmitted signal on a victim channel. This method enables to estimate worst and statistical eye-diagrams in a short time with...
In this paper, silicon/glass/organic interposers for 2.5D/3D interconnects are investigated for signal integrity analysis. As total system bandwidth increases, memory industry has been developed to satisfy its requirements. Therefore, High Bandwidth Memory (HBM) is introduced to the market. HBM enables TeraByte/s bandwidth with extremely fine pitch, short interconnects using Through Silicon Via (TSV)...
In this paper, eye-diagrams of High-Bandwidth Memory (HBM) interposer channel with crosstalk reduction schemes on 2.5D / 3D IC are estimated and analyzed. As data rate increases and metal-to-metal space decreases to achieve higher system bandwidth, crosstalk effects degrade the signal integrity. Therefore, estimation and reduction of the crosstalk effects are essential on HBM interposer channel. In...
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