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For the electrical modeling of electronic packaging composed of planar and vertical interconnections, this paper presents the combination of two integral equation based circuit extraction methods. Each method, which geometrically accords with planar or cylindrical structures, can generate equivalent circuit elements separately. The planar and cylindrical interconnection models are connected in circuit...
For the successful electrical design of system-in-package, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems...
This paper presented an efficient method to extract the interconnection parasitic elements in 3-D packaging. The use of the MPIE with the global basis functions enables automatic generation of the equivalent circuit, complexity of which can be controlled by the defined model bandwidth. The proposed method is well applied several interconnection examples, and can be extended to modeling practical problems...
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