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Correlation between near-field EMI scan and ESD susceptibility scan of a cellphone CPU IC is investigated. It is shown that the ESD susceptibility of the CPU IC depends on the activity of the IC. Based on the obtained correlation between these two scans, it is sufficient to perform the ESD susceptibility scan only by running the application which highly loads the CPU. This reduces the ESD susceptibility...
Medium Access Control (MAC) protocol is an important metric of wireless sensor networks because of its high impact on network performance. This paper proposes an energy efficient MAC protocol that can be used for both terrestrial and underwater wireless sensor networks. The state transition diagram has been presented in the paper and current consumption for each state has been recorded to evaluate...
In this article, several EMI characterization and reduction techniques have been investigated and their effectiveness is demonstrated using the developed test boards. The sum and difference outputs of the hybrid (expressed in dBm), that is placed at the output of the TEM cell, are be used to make relative comparisons between the electric and magnetic far field emissions. This data is used to compare...
An implementation of a broadband channel emulator is presented using a Finite Impulse Response (FIR) filter which operates up to 18 GHz (HMC6545LP5E). This integrated circuit has two differential channels, each having 9 adjustable taps and a delay between taps of 18 ps. The individual tap behaviors do not match to that of an ideal FIR filter. The response for each tap is measured to create a "basis...
ESD strikes can be suppressed by placing ESD protection devices along ESD current paths. As primary ESD protection on PCBs, spark gaps are cheap and take little space, but the breakdown voltage is not low enough and the lag time can be too long to protect the circuit. The effect of adding carbon and non linear polymers to the spark gap is investigated in this paper.
TVS components are widely used to protect electronic systems from ESD. However, there are various technologies of TVS components as well as numerous manufacturers for each technology. Choosing the right component is not easy, as a typical TVS data sheet does not always provide all the relevant information. This paper presents the pros and cons of different technologies as well as empirical data to...
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