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The influence of via density on the mechanical integrity of Back-End-Of-Line (BEOL) interconnects under Chip Package Interaction (CPI) loading is evaluated using a dedicated package test chip with 4 metal layers, and different via densities interconnecting the first 3 metal layers where the bottom two metal layers employ advanced low-k materials with k = 2.4 and have a low-k/metal ratio density of...
Future cochlear implants demand a higher density of stimulation sites (electrodes) and enhanced functionality (e.g. feedback information). The current generation of implanted cochlear prostheses is making use of a completely "passive scheme" and cannot meet these requirements. An "all-silicon" concept integrating active components with passive electrodes in silicon has been proposed...
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