The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
To improve the performance of 3D electronic chips, dense I/O and interconnects are required. Increasing the density of interconnects requires smaller pitch micro-bumps. However, when scaling down microbumps several challenges have to be taken into account. Lithography of dense and high aspect ratio bump, wet etching of seed and barrier layer, solder volume and intermetallics (IMC) formation are some...
In this study we discuss superiority of Cobalt for using in 3D interconnection as alternative metal to Cu. Specimens composed of pure Sn and Co or Cu is aged under same aging condition varied time and temperature below melting point of Sn. Thickness of IMC (intermetallic compound) formed at the interface is then calculated for extraction of growth rate and kinetics like activation energy and power...
In this paper,the wettability, quality of joint formation and electrical yield of daisy chains in 3D stacks when using Cobalt and Nickel as UBM with different finish layers such as immersion Au, ELD NiB, ELD Cu and SAM are investigated. The performance of the stacks are characterized by cross-section SEM images, EDS analysis and electrical resistance measurement of the daisy chains.
In this paper we report results and challenges of replacing Cu with Co as UBM (under bump metallization) in microbumps for 3D technology applications. Cobalt has softer and single IMC (intermetallic compounds) and according to calculations using Cobalt as UBM can reduce consumption of UBM material by solder which is attractive for sub 10um pitches of microbumps. However, cobalt oxidizes very fast...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.