The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Cu-Cu thermocompression bonding is the most widely accepted bonding approach for realizing multilayer chip stacking in three dimensional integrated circuits. Recently new materials and structures such as one-dimensional metallic nanostructures have been extensively investigated for the application of Cu-Cu interconnection due to their superior electrical, thermal, and mechanical properties. Herein,...
Three-dimensional integration is an emerging and promising architecture for system-level integration towards higher performance, smaller form factor, lower cost and more functionality. In this paper, a novel low temperature Cu nanorod/Sn/Cu nanorod solid-state-diffusion bonding approach for 3D integration was proposed and investigated. Cu nanorods were deposited on the electroplated Cu surface by...
Three dimensional packaging based on TSV is considered to be promising and has been accepted as the next generation technology for packaging. There are many advantages such as high speed interconnection, ultrafine pitch and high density integration. Copper bonding is one of the key bonding technologies to achieve 3D packaging with fine electrical interconnection, excellent path for thermal transfer...
Three dimensional packaging based on TSV is considered to be promising and has been accepted as the next generation technology for packaging. There are many advantages such as high speed interconnection, ultrafine pitch and high density integration. Copper bonding is one of the key bonding technologies to achieve 3D packaging with fine electrical interconnection, excellent path for thermal transfer...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.