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Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates are investigated and compared. The thicknesses of bulk and thin-film Cu substrates are 0.5 mm and 4,000 Å, respectively. Different dominant reaction products and interfacial microstructures are observed in these two types of interfacial reactions. In the bulk Cu type, the Cu5Zn8 phase is the dominant reaction product...
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