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The benefits of emerging wide-band gap semiconductors can only be utilized if the semiconductor is properly packaged. Capacitive coupling in the package causes electromagnetic interference during high dv/dt switching. This paper investigates the current flowing in the parasitic capacitance between the output node and the grounded heat sink for a custom silicon carbide power module. A circuit model...
The poor body diode performance of the first generation of 10kV SiC MOSFETs and the parasitic turn-on phenomenon limit the performance of SiC based converters. Both these problems can potentially be mitigated using a split output topology. In this paper we present a comparison between a classical half bridge and a split-output power module. It is found that the peak current during turn-on is reduced...
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