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High density indium bump bonding is in high demand for devices which operate under cryogenic environments, such as pixellated X-ray detectors for high energy physics, due to the outstanding ductility of indium even at liquid helium temperatures. For these assembly applications, the connection pitch size is shifting to below 50 mum, such that the packaging density, i.e. I/Os, may exceed 40,000/cm2...
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