The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Semiconductor companies have developed 2.5D IC integration technology, which applies a silicon interposer with Cu through silicon vias (Cu TSVs) as a platform for interconnecting and integrating heterogeneous chips horizontally and vertically as a transition approach to 3D IC. The existing Cu TSVs might make the silicon interposers more fragile, due to structural non-homogeneity and weak interface...
For the high-power LED applications, TAV (Through-aluminum-nitride-via) substrate with a high thermal conductivity provides better heat dissipation. However, the high thermal expansion coefficient mismatch between the AlN (Aluminum nitride) and copper film may cause the failure, and thus affect the reliability of TAV substrate. The objective of this study is to evaluate the reliability of TAV substrate...
The mechanical strength of the thin dies especially with copper through-silicon via (Cu-TSV), has to be determined for ensuring good yield during manufacture handling and packaging. In this study, three test methods: a line-load on elastic-foundation (LoEF) test, a 3-point bending (3PB) test and a 4-point bending (4PB) test are used for the strength determination of Cu-TSV thin memory dies. The results...
The objective of this study is to propose an in-situ measurement of the warpage of the PCB during reflow process (or SMT process) using strain gauges. In the experiments, a full-field shadow moiré is used for measuring the out-of-plane deformations (or warpage) of a bi-material plate and the PCB with DIMM sockets during solder reflow heating. A finite element method (FEM) is used to analyze the thermally-induced...
The objective of the study is to investigate the mechanical behavior of the back-plate reinforced central processing unit (CPU) assembly structure during component assembling, or under mechanical loadings such as the screw tightening torque and an independent loading mechanism (ILM) clamping forces experimentally and numerically. In the experiments, the strain gauge technique and shadow moiré measurement...
The purpose of this study is to in-situ measure the warpage of the PCB with surface-mount dual in-line memory module (DIMM) sockets during reflow process by using strain gages. In the experiments, a full-field shadow moire is used for measuring real-time out-of-plane deformations (or warpage) of the PCB with DIMM sockets under heating condition. A finite element method (FEM) is used to analyze the...
When the flip-chip packaging has been moving to the lead-free, fine-pitch and high-current-density packaging, the flip chip with copper-pillar-bump interconnects can provide a solution to this need. However, this package during the thermal cycling test (TCT) still suffers the reliability problems such as delamination at the Cu low-k materials or at the interface between the UBM (under bump metallurgy)...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.