The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The mechanical strength of the thin dies especially with copper through-silicon via (Cu-TSV), has to be determined for ensuring good yield during manufacture handling and packaging. In this study, three test methods: a line-load on elastic-foundation (LoEF) test, a 3-point bending (3PB) test and a 4-point bending (4PB) test are used for the strength determination of Cu-TSV thin memory dies. The results...
The pin-on-elastic-foundation (PoEF) test associated with theoretical equations is used for the strength determination of 3D-TSV thin memory die. FEM simulation is also applied to evaluate the test results and further provides an insight into failure mechanics. The 50μm-thick memory chips with Cu TSVs are tested, and the results of the applied load versus deflections and maximum loads for front-side...
While the semiconductor packages are evolving toward smaller package size and higher performance, the 3D IC or stacked-die packages are gaining popular. For these applications, IC wafers have to be ground to be relatively thin and the dies cut from these wafers have to possess sufficient strength against high stresses resulting from process handling, reliability testing, and operation. Hence, the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.