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GPUs have been widely adopted in data centers to provide acceleration services to many applications. Sharing a GPU is increasingly important for better processing throughput and energy efficiency. However, quality of service (QoS) among concurrent applications is minimally supported. Previous efforts are too coarse-grained and not scalable with increasing QoS requirements. We propose QoS mechanisms...
The Hybrid Memory Cube (HMC) is an innovative DRAM architecture that adopts 3D-stacking to improve bandwidth and save energy. An HMC module adopts separate receive and transmit lanes and thus may achieve the maximal memory bandwidth only if data can be driven at full speed in both directions. However, due to the natural read and write imbalance in modern applications, the effective memory bandwidth...
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and reduce the delay of interconnects significantly across the dies. However, a major challenge in 3D technology is the increased power density, which gives rise to the concern of heat dissipation within the processor. High temperatures...
The proliferation of chip multiprocessors (CMPs) has led to the integration of large on-chip caches. For scalability reasons, a large on-chip cache is often divided into smaller banks that are interconnected through packet-based network-on-chip (NoC). With increasing number of cores and cache banks integrated on a single die, the on-chip network introduces significant communication latency and power...
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and reduce the delay of interconnects across the dies. However, a major challenge in 3D technology is the increased power density which brings the concern of heat dissipation within the processor. High temperatures trigger voltage...
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