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The influence mechanism of different pad types (SMD and NSMD) on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated by experiment and Finite Element Analysis (FEA) method. The shear force of NSMD solder joint was significantly higher than SMD solder joint by using ball shear test method according to JSED22-B117A standard. The difference in shear force was attributed to the different...
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