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Multi-layer graphene nanoribbons (MLGNRs) material has been a potential solution to replace conventional Cu for next-generation on-chip interconnects. Based on equivalent single conductor model, this paper extracts the equivalent resistance-inductance-capacitance parameters for MLGNRs with consideration of edge roughness and Fermi level. A distributed circuit model for a pair of coupled MLGNR interconnects...
Through glass vias (TGVs) is the core technology of three dimensional (3-D) integration. This paper extracts the equivalent electrical parameters of carbon nanotube (CNT) based TGVs and establishes the distributed transmission line model of ground-signal-signal-ground (GSSG) type TGV interconnects. Based on the proposed equivalent circuit model, the effect of various design parameters, such as via...
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