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Time to market is becoming one of the most important factors because of the fierce market competition. However, traditional reliability and interface toughness characterization tests take very long time. For example, moisture sensitivity level assessment (MSL1) will take 168 hours pre conditioning at 85degC/85%RH and tradition thermal cycling takes even longer time. The long preconditioning times...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms in microelectronics. This failure is driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) caused by moisture absorption in plastic packaging materials. Therefore, it is important to know moisture effects on mechanical properties of...
Moisture induced failures in the plastic encapsulated packages are one most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much...
The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium...
Four types of polymer which were selected are EPN1180 and EPN1180 filled with, 40%, 50%, and 65% fused silica. The moisture absorption is carried out in an adjustable thermal and humidity chamber at different temperature and humidity. The diffusion coefficients at different conditions were obtained through the early stage moisture absorption tests. The moisture absorption was revealed to show the...
At present, a lot of delamination related reliability problems are observed in the micro-electronic industry. Examples are: die-lift; downbond stitch breaks associated with diepad delamination; passivation cracks related to interface delamination between chip and moulding compound. These reliability problems are driven by the mismatch between the different material properties, such as CTE, hygro-swelling,...
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