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With the wide application of microelectronics packaging products in the industry, the chip have been more and more attention in the harsh environment of high temperature, high humidity. Therefore how to rapidly deliver high reliability products to market has been one of the issues of concern in the microelectronics industry. However moisture sensitivity level (MSL) analysis in microelectronics packaging...
A new carbon-nanotube-based (CNTs) heat sink is developed. Due to their high thermal conductivity and aspect ratio, CNT boundles are used as fins of the heat sink. Fins as high as 300 µm with an aspect ratio of 30 are fabricated. For the thermal characterization of the heat sink, a microheater is integrated with the heat-sink and it is also used as temperature sensor. It is realized by using the low...
In this paper, a novel thermal management method of vapor chamber printed circuit board coupled with sunflower heat sink is presented. The finite element method thermal analysis module of a 110 W multi-chip GaN-based white LED lamp is developed by ANSYS parametric design language and user interface design language, the thermal performance of the LED lamp thus can be analyzed more quickly and efficiently...
Light emitting diode (LED) as the new light source has the advantages of power saving, environment-friendly, long lifetime and no pollution compared with fluorescent and incandescent lights. But the disadvantage of LED is low light lumen that only 10%~20% input power transform into the light, and 80%~90% into the heat. The junction temperature of LED is so high as to induce the lifetime declining...
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