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Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms in microelectronics. This failure is driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) caused by moisture absorption in plastic packaging materials. Therefore, it is important to know moisture effects on mechanical properties of...
Moisture induced failures in the plastic encapsulated packages are one most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much...
The increased use of mobile appliances in today's society has resulted in an increase of reliability issues related to drop performance. Mobile appliances are dropped multiple times during their lifespan and the product is required to survive common drop accidents. The use of lead-free solder compositions and the decreasing size of microelectronics aggravated the sensitivity of these products towards...
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