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The scaling limits of CMOS have pushed many researchers to explore alternative technologies for beyond CMOS circuits. In addition to the increased device variability and process complexity led by the continuous decreasing size of CMOS transistors, heat dissipation effects limit the density and speed of current systems-on-chip. For beyond CMOS systems, the emerging memory technology STT-MRAM is seen...
Most die area of today's systems-on-chips is occupied by memories. Hence, a significant proportion of total power is spent on memory systems. Moreover, since processing elements have to be fed with instructions and data from memories, memory plays a key role for system's performance. As a result, memories are a critical part of future embedded systems. Continuing CMOS scaling leads to manufacturing...
Today's memory systems mainly integrate SRAM, DRAM and FLASH technologies. SRAM and DRAM are generally used for cache and working memory, while FLASH memory is used for non-volatile storage at low speed. But all are facing to manufacturing constraints in the most advanced node, which compromises further evolution. Besides, with the increasing size of the memory system, a significant portion of the...
As complexity of embedded system increases, configurable hardware is becoming more attractive because it provides a fast and efficient basis for design development. As a consequence, one of the most promising embedded architecture consists in the replication of Processing Elements (PEs) connected through a Network-on-Chip (NoC). Such architectures provide computation parallelism, scalability, and...
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