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We experimentally realized on-chip deformed microcavities supporting both highly unidirectional emission and ultrahigh Q factors exceeding 108. This type of microcavity holds potential in ultralow-threshold laser and sensitive nanoparticle detection.
We experimentally realized on-chip deformed microcavities supporting both highly unidirectional emission and ultrahigh Q factors exceeding 108. This type of microcavity holds potential in ultralow-threshold laser and sensitive nanoparticle detection.
Through glass via (TGV) technology is considered to be a cost effective enabler for micro electromechanical systems (MEMS) and radio frequency (RF) system-in-package (SIP) technology. Inductively coupled plasma (ICP) and the Bosch etching process comprise one of the most pervasive methods for via formation in silicon. Unfortunately an equivalently process for glass remains elusive. In this paper,...
Through glass via (TGV) technology is considered to be a cost effective enabler for micro electromechanical systems (MEMS) and radio frequency (RF) system-in-package (SIP) technology. Inductively coupled plasma (ICP) and the Bosch etching process comprise one of the most pervasive methods for via formation in silicon. Unfortunately an equivalently process for glass remains elusive. In this paper,...
By coating a layer of polydimethylsiloxane (PDMS) on the silica microcavity surface, we observe the Raman laser emission from PDMS, which is to our knowledge the first demonstration of polymer cavity Raman laser.
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