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Cu/Epoxy is known as one of the weakest joint in the electronic packages. Due to the lack of adhesion, the copper and epoxy encapsulant interface is prone to delaminate, and failure will happen in electronic devices. To solve this problem, the thiol-based self-assembled molecular (SAM) treatment is introduced by our group. The benzene ring will give the hydrophobic characteristic to the surface up...
Surface wettability is known that is not only governed by chemical structure but also by the surface geometrical structure. A multiscale approach on rough surface wettability study was presented in this paper. The wettability study of photo-switched trans and cis isomers of azobenzene on different substrates was first calculated by molecular dynamics calculations. Different chemical structures and...
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