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Cu/Epoxy is known as one of the weakest joint in the electronic packages. Due to the lack of adhesion, the copper and epoxy encapsulant interface is prone to delaminate, and failure will happen in electronic devices. To solve this problem, the thiol-based self-assembled molecular (SAM) treatment is introduced by our group. The benzene ring will give the hydrophobic characteristic to the surface up...
Adhesion promotion between copper-epoxy interfaces without roughening the copper substrates is critical for new generation electronic devices. This paper demonstrates a pronounced adhesion promotion of a copper-epoxy joint from 4.8 <roman>J</roman> <roman>m</roman>-2 for the untreated samples to 159 <roman>J</roman> <roman>m</roman>-2 for the interfaces...
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