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The lifetime prediction has been performed on the Al-Cu metal line using the wafer level isothermal electromigration test. A 8000-Å-thick Al-Cu (0.5%wt Cu) metal line of 800 mm long and 0.4 μmm wide is stacked with a 500 Å Ti/TiN bottom layer and a 400 Å Ti-TiN top layer. The resistance change ratio ΔR/Ri increases rapidly in the beginning (phase I), reaches a linear rate region (phase II), and finally...
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