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In this paper, an improved chemical foaming process (CFP) for wafer-level glass cavities will be demonstrated for volume production in a clean room. First of all, suitable foaming agents transferring techniques are investigated to avoid powder pollution to the chips in a clean room. In addition, the precise controlling of the sizes of the glass cavities is studied theoretically and experimentally...
This paper reports an innovative molding process for the fabrication of low cost wafer-level micro-lens array with spacers of optical applications. The concave mold for the micro-lens includes two parts: the upper glass mold and the under silicon mold. The upper glass mold was prepared by combining the Hot Forming Process (HFP) and the Chemical Foaming Process (CFP). The under silicon mold was prepared...
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