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In this paper, inclined conductive bumps (ICBs) are proposed as a substitute for the anisotropic conductive film (ACF). The new interconnection method ICBs can provide controlled bump deformation, uniform electrical conductivity, and fine pitch interconnection without short circuit. The ACF is widely used in the chip-substrate bonding process in today’s display and semiconductor industries. This is...
This paper presents the experiment work and numerical solution to investigate wrinkle formation and evolution in thin membranes at elevated temperatures. The specimens consist of Kapton circular membranes supported on steel substrate. The membranes were heated from room temperature to 100deg. The DIC (digital image correlation) was used to monitor the profiles of membranes at discrete temperatures...
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