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This paper examines the comprehensive effects of vapor pressure, hygroscopic swelling and thermal expansion on the reliability of stacked die package during soldering reflow by the finite element analysis. First, the moisture concentration distributions were obtained for preconditioning at MSL 1 as well as desorption at the reflow process. For the diffusion modeling, existing normalization approaches...
The stresses due to moisture saturation on microelectromechanical systems (MEMS) sensor devices after exposure to temperature cycling have been addressed. Moisture-, temperature-, and time-dependent material property of molding compounds for the MEMS devices were characterized. To determine the coefficient of hygroscopic swelling of a molding compound and diffusivity ($D)$ of water in the molding...
Many polymer based materials, such as molding compound, are commonly used in plastic encapsulated packages. In spite of many advantages, most of them, however, are hydrophilic and absorb moisture when exposed to a humid environment. This induces swelling and deformation mismatches in a package and leads to failure in some cases. Polymer materials swell upon absorbing moisture, while the adjacent non-polymeric...
Many polymer based materials, such as molding compound and underfill, are commonly used in plastic encapsulated packages. In spite of many advantages, most of them, however, are hydrophilic and absorb moisture when exposed to a humid environment. Moisture absorption induces swelling and deformation in a package and leads to failure in some cases. For example, when polymer materials swell upon absorbing...
Moisture that penetrates into the electronic package causes catastrophic crack propagation during reflow process, known as ldquopop-corningrdquo. The void at interface between encapsulant and other non-polymeric components such as metal lead frame plays an important role in crack initiation and propagation. As packages experience high temperature over 240degC during reflow process, the pressure inside...
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