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Polymer based materials are widely used in electronic packaging. The molding compound, in particular, comprises a significant portion of the package with the purpose of protecting the chips from the environment. Material characterization of molding compounds, therefore, has been a critical issue in predicting the thermo-mechanical behavior and reliability of electronic packaging. One of the distinctive...
Packaging materials influence greatly on reliability and performance of electronics components. While, materials such as molding compound protect the package from the environment; different mechanical properties of materials will inevitably introduce stress to the package. In this study, materials' viscoelastic effect on packaging stress in a MEMS sensor was studied using finite element analysis after...
In order to protect electronic components on a Printed Circuit Board (PCB) against electromagnetic radiation/wave, a shielding in the form of an electrically conductive shield-can or box is normally attached on the PCB covering the electronic components. The attached shield-can could provide an additional mechanical strength and minimize the out-of-plane deformation especially where the electronic...
Many polymer based materials, such as molding compound and underfill, are commonly used in plastic encapsulated packages. In spite of many advantages, most of them, however, are hydrophilic and absorb moisture when exposed to a humid environment. Moisture absorption induces swelling and deformation in a package and leads to failure in some cases. For example, when polymer materials swell upon absorbing...
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