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In this study both finite element modeling and experimental techniques are employed to study the reliability of electronics components under random vibration loading conditions. A fatigue life estimation procedure, that would help analyst to make relatively accurate prediction of induced fatigue life, Finite Element model of the test vehicle is built using ANSYS software. The model is first validated...
A combination of various experimental techniques was coupled with three-dimensional numerical simulation to study the strain distribution in anisotropic, heterogeneous lead (Pb)-free solder ball grid array interconnects used in electronic packages. An in situ full-field deformation map on the cross section of the joint showed a nonuniform strain distribution when the package was subjected to thermal...
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