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The beneficial role played by non-conductive film (NCF) under-fill (UF) compared with the conventional capillary under fill (CUF) is meticulously investigated for the reliability issues in high-density 3D-integration at die/wafer-level. The NCF with co-efficient of thermal expansion (CTE) value of 35 ppm/°C tremendously reduces the local deformation of 20 pm-thick three-dimensionally (3D)-stacked...
Recently, encryption LSIs are embedded in a variety of digital products for security and copyright protection. Most LSIs including encryption LSIs have scan paths for manufacturing tests. However, there is a risk that the secret information is leaked through scan paths. It is necessary to prevent side channel attacks to encryption LSIs. In this paper, we show all the factors for scan-based attacks...
The authors have developed an ECL (emitter-coupled logic) 64-kb RAM with 3680-gate logic gate array LSI using bipolar technology. The address access time is 1.4 ns (typical), clock access time is 1.8 ns (typical), and the propagation delay of the logic rate is 85 ps. The chip is 13.5 mm2 in area and packaged in a 462-pin grid array
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