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In article number 1605223, Fengyu Li, Yanlin Song, and co‐workers demonstrate a swarm‐intelligence‐inspired spontaneous process to assemble nanoparticles into an optimal interconnect between certain nodes on various substrates. The optimal interconnect leads to a 65.9% decrease in electromagnetic interference, a 17.1% decrease in delay, and a 24.5% decrease in energy‐delay.
A spontaneous process is demonstrated to assemble nanoparticles into an optimal interconnect, as natural systems spontaneously figure out the shortest path. The optimal interconnect leads to a 65.9% decrease in electromagnetic interference, a 17.1% decrease in delay, and a 24.5% decrease in energy‐delay. It will be of great significance for interconnect fabrication of versatile electronic circuits...
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