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A methodology for designing high-frequency ultrasonic transducers is proposed in order to improve the speed and stability of bonding as well as the conversion efficiency of ultrasonic energy, and the phases of the design process are expressed in detail. The design process can be divided into three steps: the topology design of the components, finite element method (FEM) aided analysis optimization...
A positioning system using computer vision technologies is designed to obtain high precision during wire bonding. The main processes are on-line examining the position of a chip before bonding, calculating its locating errors, and cooperating with control system to eliminate these errors. Therefore, chips' accurate positions can be obtained which can improve the technology of wire bonding. A novel...
Facing IC packaging, a high speed precision positioning x-y table with new elastic decoupling mechanism is developed based on the voice coil actuator (VCA) direct driving. The small moving mass makes it possible that the positioning table moves at high speed and precision. The decoupling theory is expatiated. By use of the FEA and dynamic simulation method, the dynamic characteristics of the high...
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