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The wide band-gap (WBG) semiconductor electronics such as silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular in power electronics applications due to their excellent functionality at higher operating temperatures, powers, frequencies and in high radiation environments compared to Si devices. However, the continued drive for higher device and packaging densities has led to extreme...
Microprocessor are seeing an exponential rise in switching speeds and transistor densities, which are leading to significantly higher heat fluxes. Two-phase schemes utilizing boiling are becoming very popular over the past few years due to their ability to tackle much higher heat dissipation challenges in comparison to single-phase schemes. In this paper, we investigate thermal performance and pressure...
We here present an approach to cooling of electronics requiring dissipation of extreme heat fluxes exceeding 1 kW/cm2 over ∼1 cm2 areas. The approach applies a combination of heat spreading using laser micromachined diamond heat sinks; evaporation/boiling in fine featured (5 µm) conformal porous copper coatings; microfluidic liquid routing for uniform coolant supply over the surface of the heat sink;...
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