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The partial element equivalent circuit method (PEEC) has been popularly used for signal integrity and power integrity. Its port setup usually only includes conductive effects in the format of current sources or voltage sources. However, its radiation effect was neither included nor studied. In this paper, for the first time we provide novel solutions to approximate the radiation contributions from...
The reduction of electromagnetic radiation and couplings is a fundamental issue for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) issues. Even though they represent distributed sources, radiation physics was seldom mapped to the geometry of the structure. In this paper, we develop a new approach based on PEEC to calculate the distributed sources for radiation and the couplings...
Graphene is being proposed as a new nano material for EMC shielding and absorption due to its tunable resistive characteristics. The surface conductivity of graphene can be flexibly tuned by the electrostatic and magnetostatic bias applied on the graphene surface. Hence, its absorption and radiation characteristics of graphene are changed accordingly. The static electric bias applied on the graphene...
Due to the rising signal speed in today's integrated circuits (ICs), the digital input/output (I/O) device modeling becomes a very serious challenge. However, its nonlinearity issue was even less addressed. But for accurate EMC and EMI characterizations, the I/O nonlinearity could become a source of unexpected EMC and EMI troubles in the high-speed system. In this paper, we analyze the nonlinearity...
In this paper, the broadband accuracy of the mixed-form fast multipole algorithm (MF-FMA) is improved by applying rotation techniques. Two kinds of rotation methods are employed respectively. One is the coordinate system rotation technique. The other one is the pseudospectral projection based on fast Fourier transform (FFT). Either of them has certain advantages depending on the number of multipoles...
The IC packaging EMC/SI/PI problems have been broadly attested. But IC packaging EMI was seldom addressed. Because the EMI emission by IC packagings is increasingly significant, in this paper, EMI behaviors are systematically studied. To fundamentally understand the radiation mechanism, radiated contributions from ground lids, vias, and traces of the packaging are investigated and modeled separately...
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