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In this paper, a novel Si interposer for hermetical MEMS oriented System-in-Package application is presented and it is a low stress, scalable platform with a stress releasing function. It's composed of Si posts which are Air-gapped from Si interposer substituting traditional Copper TSVs to function as electrical interconnection paths, re-distribution layer (RDL) and landing pads for chip stacking...
Metallic wafer bonding is today becoming a key enable technology in MEMS packaging and heterogeneous integration. The Si/Al/Sn-Sn/Al/Si bonding structure with low temperature, low pressure and short bonding time is investigated in this paper. The bonded 4 inch Si wafers were diced into dies. Scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) were applied for interface...
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