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This study investigated the laser‐induced damage arising from 266 and 532 nm laser ablation of SiNx films on alkaline textured Si surfaces with nanosecond and picosecond pulse durations using a combination of optical‐thermal simulations and measurements of carrier recombination current density. Simulations predict that the melting depth is limited to within 150 nm of the SiNx/Si surface after 266...
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