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Self-aligned double patterning (SADP) is being considered for use at the 10-nm technology node and below for routing layers with pitches down to $\boldsymbol {\sim }50$ nm because it has better line edge roughness and overlay control compared to other multiple patterning candidates. To date, most of the SADP-related literature has focused on enabling SADP-legal routing in physical design tools while...
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