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Education of embedded systems is essential for Computer Science and Electrical Engineering students. However, traditional courses of embedded systems in the university cannot satisfy all industrial requirements anymore due to the extreme wide applicable area of embedded systems nowadays. In this article, we propose a series of short courses for learning embedded systems. Three hardware platforms focusing...
This paper presents a thermal analysis result for a 3D heterogeneous embedded system integration MorPACK (morphing package) platform. The MorPACK platform is stacked by heterogeneous submodules composed of bare dies, a substrate, connection bridges, and solder balls. Since the tiny, heterogeneous and integrable characteristics of MorPACK platform, it needs to be fabricated in high-density and laminar...
With the ever increasing complexity of System-on-a-chip (SoC) and the pressures of short time-to-market and low cost requirements, the platform-based design paradigms have been commonly used for SoC designs. Modular and flexible design becomes very important features for enhancing expandability and re-configurability of the system. The embedded system focuses on specific application instead of general...
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