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The maximum avalanche energy that the power MOSFET devices can sustain is primarily determined by the device design and manufacturing process. However, the layout of the thick Al wires on the source pad of the chip also has some influences on it. In this research, two different MOSFETs (400V/5.5A; 75V/75A) were chosen and two or three Al wires were bonded with different layouts to investigate the...
In this paper, finite element analysis (FEA) was used to evaluate the stress distribution on quad flat no-lead (QFN) packages. Different models were established, including moisture diffusion, thermo-mechanical stress, hygro-mechanical stress and hygro-thermo-mechanical stress models. The transient moisture absorption and desorption analysis were performed to estimate the package moisture distribution...
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