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Emerging memory technologies such as STT-RAM, PCRAM, and resistive RAM are being explored as potential replacements to existing on-chip caches or main memories for future multi-core architectures. This is due to the many attractive features these memory technologies posses: high density, low leakage, and non-volatility. However, the latency and energy overhead associated with the write operations...
In this paper, we propose an energy-efficient 3D-stacked CMP design by both temporally and spatially finegrained tuning of processor cores and caches. In particular, temporally fine-grained DVFS is employed by each core and L2 cache to reduce the dynamic energy consumption, while spatially fine-grained DVS is applied to the cache hierarchy for the leakage energy reduction. Our tuning technique is...
System-in-Package (SiP) and 3D integration are promising technologies to bring more memory onto a microprocessor package to mitigate the "memory wall" problem. In this paper, instead of using them to build caches, we study a heterogenous main memory using both on- and off-package memories providing both fast and high-bandwidth on-package accesses and expandable and low-cost commodity off-package...
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