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MODERN multimedia applications demand higher data rates. This has been recently proven by the accelerating sales of IEEE 802.11 family WLAN hardware. Current WLANs are, however, capable of delivering only 30-100 Mb/s connection speeds, which is insufficient for future applications like wireless high-quality video conferencing. For these and many other purposes, more capacity, wirelessly, is needed...
This paper describes a novel method for low loss 0-level packaging of RF devices by using a PerMX dry film photoresist, which promises a low temperature, low cost, and high throughput process. RF characterization using Au microstrip lines showed that PerMX material exhibited dielectric constant of 3.0 and loss tangent of 0.02 at 10GHz. HFSS simulation results showed that the dimension of PerMX packaging...
This letter presents a 60-GHz millimeter-wave antenna fabricated with a wafer-scale packaging technology. A feeding network is designed in a coplanar waveguide (CPW)-fed aperture on GaAs substrate. The radiating patch is realized in a 0-level packaging cavity using a glass substrate with a low dielectric constant. The circular polarization is achieved by an inclined coupling slot to the boundary of...
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