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Three-dimensional integrated circuit as an extension of the conventional two dimensional processes is viewed as the best choice to continue Moore's law. The extreme miniaturization of size and the complication combination of structure of 3-D integrated circuit make a higher request to the relevant technologies including wafer thinning. Be living in the process of finding the new principle of wafer...
Molecular dynamics simulations are used to investigate mechanical properties of < 1 0 0 >, < 1 1 0 > and < 1 1 1 > oriented copper nanowires under different torsional loading rate and temperature. The embedded-atom potential is employed to describe the interactions between Cu atoms. The effects of loading rates and temperature on the critical angle of Cu are discussed. These results...
Thermal properties of different metal/graphene interfaces were analyzed by molecular dynamics (MD). Thermal interface conductance of three metal/graphene interfaces, Ni/graphene, Cu/graphene, and Au/graphene, was investigated from 200K to 500K. For Cu/single-layer graphene (SLG) and Ni/SLG interfaces, thermal interface conductance was independent of temperature. Thermal interface conductance was around...
During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
Defects could be inevitably generated during the growth or the artificial operation of graphene. The existence of structure defects could be influence to excellent properties of graphene. Non-equilibrium molecular dynamics (NEMD) simulations was used to investigate the thermal conductivity of graphene with single vacancy (SV) and stone-wales (SW) defects. Dependence of temperature showed that thermal...
The reliability of electric connection and a stable contact resistance value is usually the most important thing for electrical connector, especially for the electrical connector used in severe environment such as frequently vibration. The present study has investigated the relationship between shrink range and contact resistance of a kind of electrical connector by using the ANSYS software. A indirect...
The paper investigates the insertion force and contact reliability of N electric connector. A finite element model (FEM) of the contacts was created and simulation of the contact force was completed by ANSYS. Impact of the friction coefficient, shrink range, length of socket, and groove width on the insertion force was analyzed by changing the structural parameters. Variation curves of the insertion...
During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
Defects could be inevitably generated during the growth or the artificial operation of graphene. The existence of structure defects could be influence to excellent properties of graphene. Non-equilibrium molecular dynamics (NEMD) simulations was used to investigate the thermal conductivity of graphene with single vacancy (SV) and stone-wales (SW) defects. Dependence of temperature showed that thermal...
The reliability of electric connection and a stable contact resistance value is usually the most important thing for electrical connector, especially for the electrical connector used in severe environment such as frequently vibration. The present study has investigated the relationship between shrink range and contact resistance of a kind of electrical connector by using the ANSYS software. A indirect...
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