The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The finite element model of bump bonding is built and loads with conditions of bonding time, bonding pressure and bonding power at the same time, and the stress and strain analysis of the pad will take place using this bump bonding finite element model. The result show that: the stress and strain distribution of the pad is not even and increasing with the time, the largest stress and strain all locate...
The finite element model of bump bonding is built and loads with conditions of bonding time, bonding pressure and bonding power at the same time, and the stress and strain analysis of the pad will take place using this bump bonding finite element model. The result show that: the stress and strain distribution of the pad is not even and increasing with the time, the largest stress and strain all locate...
The relationship between surface mount component solder joint section area and solder defect, section height and solder defect, contact angle and solder defect were studied respectively. By using dividing method, the contour data of solder joint center section was obtained and the shape parameters of solder center section were calculated. By using the least-square method, regression analysis was carried...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.