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In the phosphor coating process of the phosphor-converted light-emitting diodes (pc-LEDs) packaging, the phosphors settle spontaneously due to the density difference between the phosphor particles (YAG-04, about 4800 kg/m3) and the silicone matrix (OE6550 A/B, about 1120 kg/m3). The phosphor sedimentation affects the phosphor distribution and changes the optical performance of pc-LEDs, such as the...
The phosphor-converted light emitting diodes (LEDs) are the most frequently used white light LED. Due to the Stoke's loss, the silicone/phosphor composites generate a considerable amount of heat. However, as a result of different sedimentation times or coating processes, the phosphor particles present different distributions in the silicone matrix, which has been proved to strongly influence the performance...
The phosphor-converted light emitting diodes (LEDs) are the most frequently used white light LED. Due to the Stoke's loss, the silicone/phosphor composites generate a considerable amount of heat. However, as a result of different sedimentation times or coating processes, the phosphor particles present different distributions in the silicone matrix, which has been proved to strongly influence the performance...
Previous researchers usually set a constant heat transfer coefficient (HTC) for the surface heat exchange according to experience or empirical formulas to investigate the distribution of temperature and stress in their thermo-mechanical analysis, but this method does not satisfy the real condition since HTC may not be the same as people assume especially when the size is very small. Moreover, HTC...
Thermal contact resistance is an important parameter for the thermal management of electronics packaging. A type of test instrument for measuring thermal contact resistance was presented in this paper. Thermal contact resistance across a brass-brass (Cu-Cu) interface was investigated by the present instrument. The results show that the contact thermal resistance is at the magnitude of 10-4 for the...
As the power density enhances while package size decreases, thermal management becomes a primary concern of the reliability and performance of the electronic packaging. When the natural convective heat transfer can't meet the thermal budget, a forced convective heat transfer must be employed in order to prevent the inappropriate temperature and thermal induced stress which would cause many problems...
Multiple-chip packaging becomes common in LEDs packaging community. For such types of packaging, thermal spreading resistance is an important factor to impact the total thermal performance of LEDs. In this paper, a general analytical solution based on the method of variable separation for thermal spreading resistances of eccentric heat sources on a rectangular flux channel is used to calculate the...
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