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Low light extraction efficiency (LEE) is one of the most challenging points for light-emitting diode (LED) array packaging. Analysis of LEE enhancement of LED array packaging with micro-structures on packaging silicone is presented. To obtain high LEE, micro-structures including inversed cone, inversed frustum of a pyramid (FP) and V-groove are introduced. Two types of LED chips consisting of conventional...
Traditional LED packaging always adopts hemisphere lens, although which can ensure high light output efficiency, its light beam is of circular symmetry and non-uniformity. Therefore, LED by traditional packaging cannot be applied in lighting directly and bulky secondary lenses have to be used, which will make the traditional lighting companies difficult to switch to LED lighting and the lamps are...
When junction temperatures of the light emitting diode (LED) chips packaged inside LED lamps exceed their maximal limits, the optical extraction and the reliability/durability of the LED lamps will be jeopardized, therefore, thermal management is very important for high power LED street lamps. In this research, a design and optimization method of horizontally-located plate fin heat sink was presented...
High-power-light-emitting-diode (LED) packaging is crucial for the development of solid-state lighting. Phosphor's location could affect the LED packaging performance such as light extraction and correlated color temperature (CCT). This paper systematically analyzes first the effects of phosphor's location on LED packaging performance. A two-light-source step computation method based on the Monte...
Aiming to study dynamic mechanical properties of the transparent silicone resins for LEDs packaging and the effects of dynamic mechanical properties on the reliability of high power LEDs, dynamic mechanical analysis (DMA) has been adopted to study one silicone resin used for packaging high power white light LEDs. The viscoelastic behavior of silicone resin was obtained from multi-frequencies dynamic...
The efficiency and reliability of solid-state lighting devices strongly depend on successful thermal management. High-brightness light emitting diodes (LEDs), as a strong candidate for the next generation general illumination applications, were developed by improving luminous efficiency and integrating multi-chips within limited areas. One of key problems is cooling in developing high power LED for...
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