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The miniaturization trend is driving the industry to adopt low standoff components or components in cavity. The cost reduction pressure is pushing the telecommunications industry to combine component assembly and electromagnetic shields in one single reflow process. As a result, flux outgassing/drying is getting very difficult for devices due to poor venting channels. This results in insufficiently...
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step...
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step...
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature, high alloy surface tension, miniaturization, air soldering due to low cost consideration, and environmental concern. Accordingly, the flux features desired included high thermal stability, high resistance against burn-off, high oxidation resistance, high oxygen barrier capability, low surface tension,...
Miniaturization results in excessive oxidation for reflow soldering applications. Approaches for enhancing the oxidation barrier restricts the potential for improvement due to the difficulty of concurrent solder paste deposition. A new lead-free no-clean paste Indium 8.9ATG has been developed, which provides both superior anti-oxidation and printing performance. The flux technology developed also...
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