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High-Pb solders have been used as die-attach and interconnect materials for decades in discrete power components. Because of the known harmful effects of Pb to human health and the environment, as well as the demand of the wide-band-gap SiC/GaN power devices serving under high power density and high junction temperature, alternative Pb-free solders/materials and solutions have been studied intensively...
Due to the global trend of green manufacturing, lead-free becomes the main stream soldering choice of electronic industry. SnAgCu alloys are the prevailing choices, with SnCu(+Y), SnAg(+Y), and BiSn(+Y) families also being adopted, where Y represents minor additive elements. The soldering processing window is narrower than that of Sn63, mainly due to the elevated melting temperature of SnAgCu solder...
The impact reliability of solder joints in electronic packages is critical to the lifetime of electronic products, especially those portable devices using area array packages such as ball-grid array (BGA) and chip-scale packages (CSP). Currently, SnAgCu (SAC) solders are most widely used for lead-free applications. However, BGA and CSP solder joints using SAC alloys are fragile and prone to premature...
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