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This paper addresses various challenges and considerations associated with high-speed serial link designs. As data rates increase, the importance of assessing overall channel performance grows. Silicon-package-board co-design that considers both frequency and time domain budgets is essential for robust implementation capable of accommodating anticipated channel degradation and achieving time-to-market...
This paper discusses the die-package-PCB co-design methodology and proposes an effective modeling technique for package-PCB co-simulation. This technique accurately takes into account the discontinuities at the package-PCB interface. The proposed new methodology renders the co-simulation 2-5X less time consuming than traditional practice. Based on the new methodology, a multi-layer multi-channel BGA...
A new fabric defects segmentation approach based on texture primitive is put forward in the paper, which consists of four steps: 1) calculating texture primitive template using auto-correlation function; 2) enhancing defect image through calculating difference between each texture primitive and primitive template; 3) constructing mean gradation image to attenuate the high frequent background information;...
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