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Electrothermal analogy allows a resistive or RC network to be used for simple and convenient thermal analysis; however, it is only valid when heat transfer is purely convective or conductive. We investigate the analogy when a chip's operating environment is not purely convective, e.g. convective atmosphere with some source of heat flux, which is typically the practical case. We mathematically show...
The heat equation and the electrothermal equation are widely used in chip design, and generally supposed to be equivalent. We prove this equivalence in mathematical manner, but show that it is only valid when the boundary condition is convective. Recent technologies have a much increased leakage power, which is highly temperature-dependent. The modified thermal equations which model this dependency...
A floorplanning has a potential to reduce chip temperature due to the conductive nature of heat. If floorplan optimization, which is usually based on simulated annealing, is employed to reduce temperature, its evaluation should be done extremely fast with high accuracy. A new thermal index, named thermal signature, is proposed. It approximates the temperature calculation, which is done by taking the...
On-chip temperature and temperature gradient have been emerging as important design criteria as technology is scaled down to nano-meter regime. There have been several approaches to analyze or simulate the thermal behavior of chips, but all the approaches assume constant average power consumption of each block, which is reasonable when the change in power is localized and transient. However, as the...
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