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The Cu6Sn5 intermetallic compound is generated at the interface between OSP substrate and Sn-3.5Ag based solder containing small amount of Co or Ni additives. A small fraction of Co or Ni additive is probed in Cu6Sn5-based crystal structure, which occupies the crystal space sites of Cu atoms. The first-principle approach within the density functional theory is employed herein to explore the favorite...
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